Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2011-01-18
2011-01-18
Hyeon, Hae Moon (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S700000
Reexamination Certificate
active
07871274
ABSTRACT:
An integrated circuit (IC) adapter is disclosed to be adaptive sandwiched in between a ball grid array (BGA) integrated circuit (IC) and a printed circuit board to electrically couple the ball grid array IC and the printed circuit board. The IC adapter has a plurality of through holes therein, a resilient element in each of the through hole; in combination with a binding element for binding the integrated circuit (IC) onto the IC adapter such that the ball grid array IC can be removed, manually and without using any maintenance tool, from the IC adapter.
REFERENCES:
patent: 5702255 (1997-12-01), Murphy et al.
patent: 5877554 (1999-03-01), Murphy
patent: 5917703 (1999-06-01), Murphy
patent: 7140884 (2006-11-01), Brodsky et al.
patent: 7220134 (2007-05-01), Goodman et al.
Hyeon Hae Moon
Nichepac Technology Inc.
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