I.C. socket having conductive plastic contacts

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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439 86, 439525, 439886, 439931, H01R 909, H01R 924, H05K 100

Patent

active

048387991

ABSTRACT:
An IC socket which has contacts positioned corresponding to each pin position of an IC to be inserted and a body portion holding the contacts, characterized in that at least a part of the contact is formed of conductive resin.

REFERENCES:
patent: 4260212 (1981-04-01), Ritchie et al.
patent: 4460236 (1984-07-01), Strautz
patent: 4679884 (1987-07-01), Klemp
patent: 4684182 (1987-08-01), Gussman
patent: 4717347 (1988-01-01), Babow et al.
patent: 4747783 (1988-05-01), Bellamy et al.
patent: 4786256 (1988-11-01), Angeleri et al.
Cherian et al, Low Insertion Force DIP Socket w/Ejection Feature for testing, Programming & Burn-in Applications, Oct. 1979, pp. 350-358, Amp Inc.

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