I/C package/thermal-solution retention mechanism with spring...

Details I/C package/thermal-solution retention mechanism with spring... I/C package/thermal-solution retention mechanism with spring...

2006-08-29

2006-08-29

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S840000

Reexamination Certificate

active

07096580

ABSTRACT:
A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.

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