I/C package/ thermal-solution retention mechanism with...

Details I/C package/ thermal-solution retention mechanism with... I/C package/ thermal-solution retention mechanism with...

2005-04-26

2005-04-26

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S250000

Reexamination Certificate

active

06884943

ABSTRACT:
A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.

REFERENCES:
patent: 4611869 (1986-09-01), Bonnefoy
patent: 5262925 (1993-11-01), Matta et al.
patent: 5528462 (1996-06-01), Pendse
patent: 5770891 (1998-06-01), Frankeny et al.
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5823083 (1998-10-01), Obertegger et al.
patent: 6375475 (2002-04-01), Brodsky
patent: 6616327 (2003-09-01), Kearney et al.

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