Hypodermic syringe assembly

Details Hypodermic syringe assembly Hypodermic syringe assembly

1982-06-25

1984-02-07

Yasko, John D.

Surgery

Means for introducing or removing material from body for...

Treating material introduced into or removed from body...

A61M 500

Patent

active

044300824

ABSTRACT:
The present invention relates to a hypodermic syringe assembly for performing injections which has as components a flexible elastomeric protective cover into which the needle portion of a hypodermic syringe can be embedded, an inflexible hollow cylindrical sleeve which fits over the aforesaid elastomeric protective cover and a medication chamber which is bounded at its forward end by a metal needle and at its rear with an elastomeric stopper. The inflexible hollow cylindrical protective sleeve is provided at its front with connecting means so that when it is removed from the metal needle it can be attached at the rear of the medication chamber to serve as a plunger for performing injections. An additional feature of the inflexible protective sleeve is its provision with flexible gripping means which when depressed exert pressure upon the inner elastomeric protecting sleeve, thereby allowing the elastomeric protecting sleeve to be removed along with the inflexible protective sleeve. Alternatively, the inflexible hollow protective sleeve may be gripped at an inflexible portion of its length so that it may be removed while leaving the elastomeric cover disposed within in place.

REFERENCES:
patent: 2671449 (1954-03-01), Dann
patent: 2828742 (1958-04-01), Ashkenaz
patent: 4317446 (1982-03-01), Ambrosio et al.
patent: 4334536 (1982-06-01), Pfleger

Affiliated with

Also associated with

Rating

Hypodermic syringe assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hypodermic syringe assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hypodermic syringe assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2159768