Hyperconductive filled polymers

Compositions – Electrically conductive or emissive compositions – Free metal containing

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Details

524439, 106 119, 523137, 523457, 523459, H01B 102

Patent

active

046954040

ABSTRACT:
This invention is directed to a polymeric composition comprising a polymeric binder and silver particles and having a volume electrical resistivity of 0.0001 ohm-cm or less.

REFERENCES:
patent: 4210704 (1980-07-01), Chandross et al.
patent: 4410457 (1983-10-01), Fujimura et al.

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