Hyperbga buildup laminate

Details Hyperbga buildup laminate Hyperbga buildup laminate

2007-05-08

2007-05-08

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C029S840000

Reexamination Certificate

active

11011868

ABSTRACT:
A method and structure for forming an electronic structure that comprises a redistribution structure on a circuitized substrate. The redistribution structure includes N dielectric layers (N≧2) and N metal planes formed in the following sequence: dielectric layer1on a metallic plane that exists on a surface of the substrate, metal plane1on dielectric layer1, dielectric layer2on dielectric layer1and metal plane1, metal plane2on the dielectric layer2, . . . , dielectric layer N on dielectric layer N−1 and metal plane N−1, and metal plane N on the dielectric layer N. Metal planes or metallic planes may include signal planes, power planes, ground planes, etc. A microvia structure, which is formed through the N dielectric layers and electrically couples metal plane N to the metallic plane, includes a microvia or a portion of a microvia through each dielectric layer.

REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 4804575 (1989-02-01), Kohm
patent: 4933045 (1990-06-01), DiStefano et al.
patent: 5231751 (1993-08-01), Sachdev et al.
patent: 5316803 (1994-05-01), White, Jr. et al.
patent: 5401913 (1995-03-01), Gerber et al.
patent: 5536579 (1996-07-01), Davis et al.
patent: 5560840 (1996-10-01), Covert et al.
patent: 5626771 (1997-05-01), Davis et al.
patent: 5672548 (1997-09-01), Culnane et al.
patent: 5723062 (1998-03-01), Covert et al.
patent: 5726863 (1998-03-01), Nakayama et al.
patent: 5798563 (1998-08-01), Feilchenfeld et al.
patent: 5847935 (1998-12-01), Thaler et al.
patent: 5877550 (1999-03-01), Suzuki
patent: 5886406 (1999-03-01), Bhansali
patent: 5926377 (1999-07-01), Nakao et al.
patent: 5989443 (1999-11-01), Covert et al.
patent: 6006428 (1999-12-01), Feilchenfeld et al.
patent: 6054758 (2000-04-01), Lamson
patent: 6090633 (2000-07-01), Yu et al.
patent: 6119335 (2000-09-01), Park et al.
patent: 6165629 (2000-12-01), Sachdev et al.
patent: 6879492 (2005-04-01), Alcoe et al.
patent: 2002/0139578 (2002-10-01), Alcoe et al.

Affiliated with

Also associated with

Rating

Hyperbga buildup laminate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hyperbga buildup laminate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hyperbga buildup laminate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3821839