Hygrothermal load compensating structures in an integrated lead

Dynamic magnetic information storage or retrieval – Record transport with head stationary during transducing – Drum record

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360105, 360108, 369126, G11B 550, G11B 2118

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active

058644458

ABSTRACT:
An integrated lead disk drive suspension including a load beam and one or more conductive leads. The load beam has a mounting region on a proximal end, a head bonding platform on a distal end, and one or more spring regions connecting the head bonding platform to the mounting region. The conductive leads are integrated with and insulated from the load beam by an adhesive dielectric layer, and extend between the head bonding platform and the mounting region. The leads are adapted to reduce mechanical effects of the leads and/or dielectric layer on spring characteristics of the spring regions. One embodiment of the leads includes at least a first compensating portion which extends off the load beam and traverses a nonlinear path around at least a portion of one or more of the spring regions. In another embodiment the portions of the conductive leads extending between the distal end of the load beam and the head bonding platform are substantially free from the dielectric layer. In yet another embodiment the width of portions of the dielectric layer is about equal to or less than the width of adjacent portions of the conductive leads.

REFERENCES:
patent: 4543295 (1985-09-01), Clair et al.
patent: 4616279 (1986-10-01), Poorman
patent: 4789914 (1988-12-01), Ainslie et al.
patent: 4996623 (1991-02-01), Erpelding et al.
patent: 5103359 (1992-04-01), Marazzo
patent: 5331489 (1994-07-01), Johnson et al.
patent: 5391842 (1995-02-01), Bennin et al.
patent: 5422764 (1995-06-01), McIlvanie
patent: 5490027 (1996-02-01), Hamilton et al.
patent: 5491597 (1996-02-01), Bennin et al.
patent: 5594607 (1997-01-01), Erpelding et al.
patent: 5598307 (1997-01-01), Bennin
patent: 5606477 (1997-02-01), Erpelding et al.
patent: 5631786 (1997-05-01), Erpelding
patent: 5645735 (1997-07-01), Benin et al.
patent: 5666717 (1997-09-01), Matsumoto et al.

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