Hygroscopic resin and humidity sensor using the same

Details Hygroscopic resin and humidity sensor using the same Hygroscopic resin and humidity sensor using the same

1977-05-16

1978-10-17

Lechert, Jr., Stephen J.

Compositions

Humidostatic, water removive, bindive, or emissive

526263, 526264, 526273, C09K 300

Patent

active

041208137

ABSTRACT:
There is provided a hygroscopic resin comprising a vinyl polymer having an epoxy group, said vinyl polymer being a copolymerization product between a vinyl monomer having a hydrophilic property and a further vinyl monomer having an epoxy group. This hygroscopic resin is not soluble in water or organic solvent and is thus useful for various applications, e.g., a humidity sensor can be made by dispersing a conductive powder in the hygroscopic resin. This humidity sensor has high sensitivity to humidity and can operate stably for a long time.

REFERENCES:
patent: 3545622 (1970-12-01), Sakhnovsky et al.
patent: 4041437 (1977-08-01), Matsuura et al.

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