Hygroscopic molding

Details Hygroscopic molding Hygroscopic molding

2003-07-07

2009-12-01

Garrett, Dawn (Department: 1794)

Stock material or miscellaneous articles

Composite

Of inorganic material

C428S917000, C313S504000, C313S506000, C313S512000, C427S066000, C252S181100, C252S194000, C034S417000, C034S442000

Reexamination Certificate

active

07625638

ABSTRACT:
The present invention provides a moisture-absorbent formed body comprising 1) an amine compound and/or a thermally conductive material, 2) a hygroscopic agent, and 3) a resin component, for removing moisture from within the sealed atmosphere of an organic electroluminescent device, and thereby suppressing the occurrence of dark spots.

REFERENCES:
patent: 3565654 (1971-02-01), Story
patent: 3862963 (1975-01-01), Hoshi et al.
patent: 4013566 (1977-03-01), Taylor
patent: 4081397 (1978-03-01), Booe
patent: 4448949 (1984-05-01), Ito et al.
patent: 4873282 (1989-10-01), Yui et al.
patent: 5078909 (1992-01-01), Shigeta et al.
patent: 5300858 (1994-04-01), Nikaido
patent: 5304419 (1994-04-01), Shores
patent: 5908723 (1999-06-01), Malhotra et al.
patent: 5990615 (1999-11-01), Sakaguchi et al.
patent: 6268071 (2001-07-01), Yasukawa et al.
patent: 6633123 (2003-10-01), Tazawa
patent: 6673436 (2004-01-01), Kawaguchi et al.
patent: 6686063 (2004-02-01), Kobayashi
patent: 6753363 (2004-06-01), Harashina
patent: 6819042 (2004-11-01), Nakada et al.
patent: 6924594 (2005-08-01), Ogura et al.
patent: 2002/0050785 (2002-05-01), Nakada et al.
patent: 2003/0085654 (2003-05-01), Hayashi
patent: 61-96695 (1986-05-01), None
patent: 05-114486 (1993-05-01), None
patent: 05-290976 (1993-11-01), None
patent: 07-169567 (1995-07-01), None
patent: 10-275682 (1998-10-01), None
patent: 11-74074 (1999-03-01), None
patent: 2000-195660 (2000-07-01), None
patent: 2000-268954 (2000-09-01), None
patent: 2001-267067 (2001-09-01), None
patent: 2001-277395 (2001-10-01), None
patent: 2001-278999 (2001-10-01), None
patent: 2001-354780 (2001-12-01), None
patent: 2002-003717 (2002-01-01), None
patent: 2002-030212 (2002-01-01), None
patent: 2002-043055 (2002-02-01), None
patent: 2002-124375 (2002-04-01), None
patent: 2002-164481 (2002-06-01), None
patent: 2002-280166 (2002-09-01), None
patent: 2002-299040 (2002-10-01), None
patent: 2003-133061 (2003-05-01), None
patent: 2003-142253 (2003-05-01), None
patent: 2003-288980 (2003-10-01), None
patent: 2003-288981 (2003-10-01), None
patent: 2004-31182 (2004-01-01), None
patent: 2004-235077 (2004-08-01), None
patent: 2004-311246 (2004-11-01), None
patent: 2004-311345 (2004-11-01), None
patent: WO 01/31717 (2001-05-01), None
patent: WO 02/096160 (2002-11-01), None

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