Hydroxymethyl diphosphonated polyacrylates for red mud treatment

Details Hydroxymethyl diphosphonated polyacrylates for red mud treatment Hydroxymethyl diphosphonated polyacrylates for red mud treatment

1996-07-03

1998-01-27

Bos, Steven

Chemistry of inorganic compounds

Treating mixture to obtain metal containing compound

Group iiia metal or beryllium

210732, 210723, C01F 700, B01D 2100

Patent

active

057119236

ABSTRACT:
The invention comprises a process for improved flocculation of Bayer process red mud-containing slurry. The improvement comprises adding to the red mud-containing liquor a hydroxymethyl diphosphonic acid polymer optionally in addition to the conventional flocculant. The polymer is added to the red mud-containing liquor in an amount sufficient to reduce the concentration of suspended solids in the supernatant phase and/or increase the rate of sedimentation.

REFERENCES:
patent: 3085853 (1963-04-01), Lesinski et al.
patent: 3284393 (1966-11-01), Vanderhoff et al.
patent: 3390959 (1968-07-01), Sibert
patent: 3397953 (1968-08-01), Galvin et al.
patent: 3445187 (1969-05-01), Sibert
patent: 3541009 (1970-11-01), Arendt et al.
patent: 3681012 (1972-08-01), Sibert
patent: 4207405 (1980-06-01), Masler et al.
patent: 4678585 (1987-07-01), Brownrigg
patent: 4678840 (1987-07-01), Fong et al.
patent: 4767540 (1988-08-01), Spitzer et al.
patent: 5008089 (1991-04-01), Moody et al.
patent: 5217620 (1993-06-01), Mahoney et al.
patent: 5478477 (1995-12-01), Ramesh et al.
patent: 5534235 (1996-07-01), Reed et al.

Affiliated with

Also associated with

Rating

Hydroxymethyl diphosphonated polyacrylates for red mud treatment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hydroxymethyl diphosphonated polyacrylates for red mud treatment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hydroxymethyl diphosphonated polyacrylates for red mud treatment will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-339451