Compositions – Heat-exchange – low-freezing or pour point – or high boiling... – Organic components
Patent
1991-04-22
1992-12-01
Willis, Jr., Prince
Compositions
Heat-exchange, low-freezing or pour point, or high boiling...
Organic components
252 28, 252572, 252 73, 361386, C09K 500, H02B 100
Patent
active
051678519
ABSTRACT:
A water washable thermally conductive grease useful for thermal coupling of electronic chips and heat sinks in electronic modules comprises a hydrophilic liquid polymer carrier, an antioxidant, and up to 90 weight percent of a microparticulate thermally conductive filler. In a preferred embodiment, the thixotropic dielectric composition further comprises an ionic surfactant to promote wetting/dispersion of the microparticulate filler. The thermally conductive grease is non-corrosive, resistant to shear induced phase destabilization and capable of being washed from module surfaces with aqueous solutions. Substitution of the present hydrophilic based greases for art-recognized solvent washable greases eliminates use of non-aqueous solvents in electronic module processing/reprocessing operations.
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Product advertisement/information sheet from Thermalloy, Inc., for Thermalcote II.
Jamison William L.
Larsen Gary J.
Sears, Jr. George E.
Silbermann James
Thermoset Plastics, Inc.
Willis Jr. Prince
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