Hydrogenated block copolymers containing epoxy groups and their

Details Hydrogenated block copolymers containing epoxy groups and their Hydrogenated block copolymers containing epoxy groups and their

1992-02-05

1995-05-02

Lipman, Bernard

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525338, 525339, 525387, 525388, C08F 808

Patent

active

054120403

ABSTRACT:
A description follows of epoxydated block copolymers, either linear or branched, which can be defined with the following formulae:
1) [A-(E-B-EPOX)].sub.n X
2) A.sub.1 -(E.sub.1 -B.sub.1 -EPOX.sub.1)-A-HT-(E.sub.2 -B.sub.2 -EPOX.sub.2)
3) [(E.sub.1 -B.sub.1 -EPOX.sub.1)-HT-A(E.sub.2 -B.sub.2 -EPOX.sub.2)].sub.n X
where A is a polyvinylaromatic block in a percentage ranging from 10 to 50% by weight, E-B-EPOX is a block composed of ethylene units, epoxydated butene and diene units in which the percentage by weight of the epoxy group ranges from 1% to 40%, HT is a tapered copolymer segment made up of hydrogenated and epoxydated diene monomeric units and vinylaromatic units whose content ranges from 0 to 20%, x is a radical having a valence ranging from 1 to 20.
The block copolymers have an average molecular weight ranging from 30,000 to 400,000, a content of polyvinylaromatic blocks of between 10 and 50% by weight and a content of (E.sub.1 -B.sub.1 -EPOX.sub.1)+(E.sub.2 -B.sub.2 -EPOX.sub.2) blocks ranging from 90 to 50% by weight; the weight ratio between (E.sub.1 -B.sub.1 -EPOX.sub.1) and (E.sub.2 -B.sub.2 -EPOX.sub.2) ranges from 0.1 to 1.0. These polymers are used in the preparation of polymeric compositions based on engineering polymers such as polyamides, polycarbonate, polyesters, improving their physical properties and above all their impact strength and in mixtures with oils and hydrocarbon resins to produce materials having excellent adhesion of polar substrates.

REFERENCES:
patent: 3699184 (1972-10-01), Taylor et al.
patent: 4051199 (1977-09-01), Udipi et al.

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