Hydrogen reduction method for removing contaminants in a semicon

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437937, 437939, H01L 21265

Patent

active

053546989

ABSTRACT:
In semiconductor manufacture a method of ion implanting a substrate includes an in-situ hydrogen reduction for removing or outgassing contaminants present on the surface of the substrate. By removing the contaminants, the implantation of "knock ons" into the crystal lattice structure of the substrate is prevented. In an illustrative embodiment of the invention, the hydrogen reduction is performed using a low-temperature, high-energy hydrogen plasma. The method of the invention can be used to remove contaminants such as carbon, carbon dioxide, oxygen, sulfur, phosphorus, boron, H.sub.2 O and native oxides present on the surface to be implanted.

REFERENCES:
patent: 3506508 (1970-04-01), Nickl
patent: 4331486 (1982-05-01), Chenevos-Paule et al.
patent: 4477311 (1984-10-01), Mimura et al.
patent: 4595453 (1987-06-01), Yamazaki et al.
patent: 4698104 (1987-10-01), Barker et al.
patent: 4706870 (1987-11-01), Legge
patent: 4849375 (1989-07-01), Gluck et al.
patent: 4923828 (1990-05-01), Gluck et al.
patent: 5007232 (1991-04-01), Caudill et al.
patent: 5068007 (1991-11-01), Rogers et al.
patent: 5089441 (1992-02-01), Moslehi
Steiner et al., "Process and Module For Low Temperature Hydrogen Cleaning of Silicon Wafer", Journal Electrochemical Society Proceedings, vol. (unknown) pp. 254-264, 1992.
Clark et al., "Surface Modification of InP By Plasma Techniques Using Hydrogen and Oxygen", Electronics and Optics, Thin Solids Films 78 (1981) pp. 271-278.
Veprek et al., "The Preparation of Thin Layers of Ge and Si By Chemical Hydrogen Plasma Transport", Solid-State Electronics, Pergamon Press, 1968, vol. 11, pp. 683-684.
Chang et al., "Hydrogen Plasma Etching of GaAs Oxide", Appl. Phys Lett. 38(11), American Institute of Physics, 1981, pp. 898-900.
Webb et al., "Reactivity of Solid Silicon With Hydrogen Under Conditions Of A Low Pressure Plasma", Chemical Physics Letters, vol. 62, No. 1, (Mar. 1979), pp. 173-177.
Veprek et al., "Transport of Phosphorus in a Low Pressure Hydrogen Plasma", Z. anorg. allg. Chemic 415, 190-192 (1975), pp. 190-192.
Ghandhi, S. K., "VLSI Fabrication Principles", pp. 300-301, 337-339.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Hydrogen reduction method for removing contaminants in a semicon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hydrogen reduction method for removing contaminants in a semicon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hydrogen reduction method for removing contaminants in a semicon will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1658213

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.