Drug – bio-affecting and body treating compositions – Preparations characterized by special physical form – Web – sheet or filament bases; compositions of bandages; or...
Patent
1985-09-11
1988-05-24
Schofer, Joseph L.
Drug, bio-affecting and body treating compositions
Preparations characterized by special physical form
Web, sheet or filament bases; compositions of bandages; or...
522 64, 522 69, 527313, 527314, A61F 1300, C08F 254
Patent
active
047465140
ABSTRACT:
Homogeneous hydrogels comprise a water-soluble sugar, derivative or mixture thereof, radiation cross-linked with at least one ethylenically unsaturated compound. A preferred combination is sucrose or glucose cross-linked with acrylic acid. The hydrogels may contain additives e.g. plasticizers such as glycerol. The hydrogels are strong and expand to a large extent e.g. 30.times. on water absorption. They are particularly suitable for use in medical dressings, preferably bonded to a supporting film which may be a semi-permeable membrane allowing control of water loss. A method for preparing such a hydrogel and dressing is also described.
REFERENCES:
patent: 3296109 (1967-01-01), Leavitt
patent: 3600122 (1971-08-01), Coleman
patent: 4193845 (1980-03-01), Kaetsu et al.
patent: 4349470 (1982-09-01), Battista
patent: 4451629 (1984-05-01), Tonaka et al.
patent: 4541871 (1985-09-01), Obayashi et al.
patent: 4587319 (1986-05-01), Towinier
Walsh et al., Textile Research Journal, Jul. 1965, pp. 648-654.
Hinds William R.
Kulkosky Peter F.
Schofer Joseph L.
The Secretary of State for Defence in Her Britannic Majesty's Go
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