Organic compounds -- part of the class 532-570 series – Organic compounds – Oxygen containing
Patent
1992-06-09
1993-08-10
Lone, Werren B.
Organic compounds -- part of the class 532-570 series
Organic compounds
Oxygen containing
568451, C07C 4550
Patent
active
052351130
ABSTRACT:
A hydroformylation process for preparing a hydroformylated product by reacting an olefinic compound with hydrogen and carbon monoxide in the presence of a Group VIII metal catalyst, in the reaction of which there is present a phosphite compound having the formula (I), ##STR1## wherein R.sup.1 and R.sup.2 are respectively an aromatic hydrocarbon groups which may be the same or different and the aromatic hydrocarbon group has at least a hydrocarbon group on a carbon atom adjacent to a carbon atom bonded with an oxygen atom as a substituent; A.sup.1 is an n-valent organic group having an aliphatic hydrocarbon group, a cycloaliphatic hydrocarbon group or an aromatic hydrocarbon group bonded with an adjacent oxygen atom, which may respectively have a substituent; n is an integer of from 2 to 4; and the respective ##STR2## group may be the same or different.
REFERENCES:
patent: 4668651 (1987-05-01), Billig et al.
patent: 4717775 (1988-01-01), Billig et al.
patent: 4748261 (1988-05-01), Billig et al.
patent: 4769498 (1988-09-01), Billig et al.
patent: 4835299 (1989-05-01), Maher et al.
patent: 4885401 (1989-12-01), Billig et al.
patent: 5059710 (1991-10-01), Abatjoglou et al.
Kawaragi Yuji
Ookoshi Tooru
Sato Keiichi
Takai Masaki
Lone Werren B.
Mitsubishi Kasei Corporation
LandOfFree
Hydroformylation process and bisphosphite compound used therein does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hydroformylation process and bisphosphite compound used therein, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hydroformylation process and bisphosphite compound used therein will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1726743