Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
2004-09-10
2008-03-04
Hassanzadeh, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C156S345350, C156S345360, C156S345420, C156S345460, C118S7230MW, C118S7230MR, C118S7230MA, C118S7230AN
Reexamination Certificate
active
07338575
ABSTRACT:
A process and apparatus for cooling a plasma tube generally includes flowing a hydrocarbon dielectric heat transfer fluid into a space defined by the plasma tube and a concentric tube surrounding the plasma tube. In one embodiment, the hydrocarbon fluid is selected to have a dissipation factor less than 0.002 and a thermal efficiency coefficient greater than or equal to 1.30 kJ/kg*K.
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http://www.dynalene.com/lo230.html Printed Nov. 17, 2004 (1 page).
http://www.electronics-cooling.com/Resources/EC—Articles/MAY96/may96—04.htm Robert E. Simons, “Direct liquid immersion cooling for high power density microelectronics” Printed Jul. 21, 2004 (7 pages).
Gabriel et al., “Dielectric parameters relevant to microwave dielectric heating”, Chemical Society Reviews, 1998, vol. 27 (pp. 213-223).
Colson Michael Bruce
Pingree, Jr. Richard E.
Silbert Michael
Axcelis Technologies Inc.
Cantor & Colburn LLP
Dhingra Rakesh K.
Hassanzadeh Parviz
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