Hydraulic manifold for water cooling of multi-chip electric modu

Details Hydraulic manifold for water cooling of multi-chip electric modu Hydraulic manifold for water cooling of multi-chip electric modu

1986-04-30

1988-07-26

Lazarus, Ira S.

Heat exchange

With retainer for removable article

Electrical component

361385, H05K 720

Patent

active

047594039

ABSTRACT:
A manifold for conducting coolant to a set of heat exchangers mounted on individual electric circuit chips of a circuit module is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages connected to the apertures for conducting coolant to ports of the heat exchangers. The body is formed of two sections, one section having channels machined therein to serve as the fluid passages, and a second section having the apertures. The second section also is bounded by sidewalls which define a cavity. The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages. A plastic material is deposited on the wax mold and on the second section of the body to form the set of appendages, the plastic material being of a type which can be deposited by the process of chemical vapor deposition, thereby to provide a conformal deposition which imparts a water-tight characteristic to the manifold.

REFERENCES:
patent: 3361195 (1968-01-01), Mayerhoff et al.
patent: 3364039 (1968-01-01), Tambussi
patent: 3989099 (1976-11-01), Hosono et al.
patent: 4020399 (1977-04-01), Suzuki et al.
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4156458 (1979-05-01), Chu et al.
patent: 4209129 (1980-06-01), Haas et al.
patent: 4226281 (1980-10-01), Chu
patent: 4558395 (1985-12-01), Yamada et al.
patent: 4561040 (1985-12-01), Eastman et al.
IBM Technical Disclosure Bulletin, "Integrated Circuit Module Package Cooling Structure", A. L. Pascuzzo et al., vol. 20, No. 10, Mar. 1978, pp. 3898-3899.

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