Hybrid woven glass cloths

Details Hybrid woven glass cloths Hybrid woven glass cloths

1981-12-28

1983-02-08

Bell, James J.

Textiles: weaving

Fabrics

Materials

428225, 428257, 428258, 428259, 428901, D03D 1500

Patent

active

043723470

ABSTRACT:
Woven hybrid glass cloths which may be utilized as chip carrier substrates and as inner layers in multi-layer laminate circuit boards which will be stable due to a desired co-efficient of thermal expansion may be prepared by weaving fiberglass with a second material which possesses a co-efficient of thermal expansion of less than 5.0.times.10.sup.-6 inch/inch/.degree.C. The mixture of fiberglass in this material may be used as a warp and a fill yarn. The thus woven cloth will possess a dimensional stability suitable for use in preparing multi-layer materials and for use in direct mounting ceramic chip carriers to this chip carrier substrate. Examples of materials which possess a co-efficient of thermal expansion of less than the desired number will include nylon filaments, ceramics, boron nitrite filaments, etc.

REFERENCES:
patent: 4201247 (1980-05-01), Shannon
patent: 4304811 (1981-12-01), David et al.

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