Hybrid welding wafer

Details Hybrid welding wafer Hybrid welding wafer

1987-01-09

1989-09-05

Wityshyn, Michael

Electric heating

Heating devices

Combined with pressure application means

30115, 30140, 83171, 156499, 156510, 219233, 219543, B26D 710, B29C 6520

Patent

active

048641014

ABSTRACT:
A thin wafer for cutting plastic tubes which are to be butt welded together includes a high temperature insulated plate-like core with a resistance circuit on the core for heating the wafer to a temperature sufficiently high to melt through the tubes. A glass layer may be on the outer surface of the water, particularly in the contact area with the tube. The wafer may be used in an arrangement wherein residue is removed from the water by having the residue adhere to unused portions or stubs of the tubes which then would be stripped from the wafer.

REFERENCES:
patent: 2859321 (1958-11-01), Garaway
patent: 4369779 (1983-01-01), Spencer
patent: 4412123 (1983-10-01), Ammann et al.
patent: 4412835 (1983-11-01), Spencer
patent: 4501951 (1985-02-01), Benin et al.
patent: 4507119 (1985-03-01), Spencer
patent: 4516671 (1985-05-01), Spencer
patent: 4521263 (1985-06-01), Benin et al.
patent: 4610670 (1986-09-01), Spencer
patent: 4619642 (1986-10-01), Spencer
patent: 4622966 (1986-11-01), Beard

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