Electrical connectors – Including handle or distinct manipulating means – Randomly manipulated implement
Patent
1992-10-13
1994-08-16
Nguyen, Khiem
Electrical connectors
Including handle or distinct manipulating means
Randomly manipulated implement
324757, H01R 1118
Patent
active
053382234
ABSTRACT:
A hybrid wafer probe (10) for probing metallized areas (12) on a substrate (14), such as a semiconductor wafer, includes an insulative member (16) having a ground plane (21) on at least one of its major surfaces. Embedded within the insulative member (16) is a plurality of wires (24) each having a first end (26) protruding beyond the member for connection to a testing machine. Each wire has a second end (28) provided with a sharp tip (30) that protrudes through the member (16) in a region spaced from the ground plane (21) so as to depend below the member for making contact with the metallized areas on the substrate to be probed. By displacing the member (16) relative to the substrate (14) while the tips (30) of the wires 24 are in contact with the metallized area, the tips can scratch the surface of the metallized areas to make a reliable electrical connection therewith.
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IBM Technical Bulletin, vol. 15, No. 4, Sep. 1972.
Melatti Livio R.
Velasco Victor J.
AT&T Bell Laboratories
Levy Robert B.
Nguyen Khiem
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