Hybrid surface mountable packages for very high speed...

Details Hybrid surface mountable packages for very high speed... Hybrid surface mountable packages for very high speed...

2011-03-01

2011-03-01

Takaoka, Dean O (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Waveguide elements and components

C333S246000, C333S260000

Reexamination Certificate

active

07898370

ABSTRACT:
In one example, a hybrid surface mountable package includes a housing at least partially defining a sealed cavity, two microwave integrated circuits (MIC) chips positioned inside the sealed cavity, and a very-high-speed interconnect connecting the two MIC chips to each other. The very-high-speed interconnect includes strong coupling co-planar waveguide (CPWG) transmission lines.

REFERENCES:
patent: 6624508 (2003-09-01), Koh
patent: 6674347 (2004-01-01), Maruhashi et al.
patent: 6774748 (2004-08-01), Ito et al.
Yasutake, Hirachi et al., Status of millimeter-wave MMIC's and their applications in Japan, Oct. 2000, Microwave Conference, 30th European, 4 pages.
Maruhashi, K et al., 60GHz-Band Flip-Chip MMIC Modules for IEEE1394 Wireless Adapters, Sep. 2001, Microwave Conference, 31st European, 4 pages.
MSA Reference Document for 300 Pin and 40Gb Transponder, Jul. 2002, MSA, Edition 3, 38 pages.

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