Hybrid substrate for cooling an electronic component

Details Hybrid substrate for cooling an electronic component Hybrid substrate for cooling an electronic component

1997-09-30

1999-09-28

Speer, Timothy

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having a component wherein a constituent is liquid...

4283227, 4283044, 4283066, 174258, B32B 326

Patent

active

059585722

ABSTRACT:
The substrate (10) has a first side (12) and a second side (14) and includes an insert material (16) having a first thermal conductivity (24) in a first direction (25) and having a second thermal conductivity (26) in a second direction (27). A plurality of vias (30) are formed in the second direction through the insert material and an encapsulant material (18) surrounds the insert material. When an electronic component (22) is disposed on the first side, heat (25) from the electronic component is conducted in the first direction by the insert material and is conducted in the second direction through the plurality of vias.

REFERENCES:
patent: 5296310 (1994-03-01), Kibler et al.
Product Description Documents by Advanced Ceramics Corp. for the following products: TC1050 Encapsulated TPG; TC1050.ALY Aluminum Encapsulated TPG; TC1050.CFC Carbon FIber Composite encapsulated TPG; TC1050.KOV Kovar Encapsulated TPG; TC1050.CO Copper Encapsulated TPG; TC1050.MMC A1SiC Encapsulated TPG/ Jan. 1995.
Product Overview Document for "TC1050 Thermal Management Material System" by Advanced Ceramics Corp. Dec., 1994.
Preliminary Product Data for "High Thermal Conductivity Black-Ice .TM. Substrate Materials", Applied Sciences, Inc., Cedarville, Ohio Jan. 1995.
ClimaxClad Copper-Molybdenum-Copper product brochure, Climax Specialty Materials, Cleveland, Ohio. Jan. 1990.

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