Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Having enclosed cavity
Reexamination Certificate
2007-02-13
2007-02-13
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Having enclosed cavity
C257SE21122
Reexamination Certificate
active
11202834
ABSTRACT:
A hybrid substrate, i.e., a substrate fabricated from different materials, and method for fabricating the same are presented. The hybrid substrate is configured for fabricating more than two different devices thereon, has a high thermal conductivity, and is configured for patterning interconnects thereon for interconnecting the different devices fabricated on the hybrid substrate.
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Hsu Louis L.
Wang Li-Kong
Coleman W. David
International Business Machines - Corporation
Perez, Esq. Rafael
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