Hybrid substrate and method for fabricating the same

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Having enclosed cavity

Reexamination Certificate

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C257SE21122

Reexamination Certificate

active

11202834

ABSTRACT:
A hybrid substrate, i.e., a substrate fabricated from different materials, and method for fabricating the same are presented. The hybrid substrate is configured for fabricating more than two different devices thereon, has a high thermal conductivity, and is configured for patterning interconnects thereon for interconnecting the different devices fabricated on the hybrid substrate.

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