Printing – Stenciling – Processes
Reexamination Certificate
2005-03-29
2005-03-29
Evanisko, Leslie J. (Department: 2854)
Printing
Stenciling
Processes
C101S115000, C101S116000, C101S128400, C101S490000, C358S001900, C358S001130
Reexamination Certificate
active
06871589
ABSTRACT:
A hybrid stencil printing apparatus comprises: a stencil-making/printing unit configured to perforate a stencil sheet corresponding to a desired image, to wind the stencil sheet around an outer peripheral surface of a print drum, and to transfer a printing medium to the print drum with pressure and the printing medium is printed; an other-method image-formation unit configured to print the printing medium transferred on the same transfer passage as the stencil-making/printing unit according to a different printing method from the stencil-making/printing unit; and an image-formation unit selection-unit configured to input an original digital image, to determine a attributes of each image portion of the inputted original digital image, and to allocate each image portion selectively to the stencil-making/printing unit or the other-method image-formation unit based on the determination result.
REFERENCES:
patent: 5369507 (1994-11-01), Tanaka et al.
patent: 6038977 (2000-03-01), Haney et al.
patent: 6070525 (2000-06-01), Watanabe et al.
patent: 6244183 (2001-06-01), Haney et al.
patent: 6377703 (2002-04-01), Yeung
patent: 6688220 (2004-02-01), Ohno
patent: 0 710 552 (1996-05-01), None
patent: 0 771 647 (1997-05-01), None
Evanisko Leslie J.
Kang Gregory B.
Nath Gary M.
Nath & Associates PLLC
Riso Kagaku Corporation
LandOfFree
Hybrid stencil printing apparatus, method for controlling... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hybrid stencil printing apparatus, method for controlling..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hybrid stencil printing apparatus, method for controlling... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3387124