Hybrid semiconductor circuit with programmable...

Details Hybrid semiconductor circuit with programmable... Hybrid semiconductor circuit with programmable...

2006-01-31

2006-01-31

Tan, Vibol (Department: 2819)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S109000, C257S723000, C326S047000, C326S041000

Reexamination Certificate

active

06991947

ABSTRACT:
Field programmable circuits and redundant logic are added to the substrate of a hybrid circuit with functionality to bypass and/or repair unusable dies in order to enhance yield and lower costs of manufacture. In a preferred embodiment, a collar of programmable logic is inserted between the functional component on the hybrid die and its I/O terminals. The programmable logic collar can be programmed after hybrid assembly and test in order to correct assembly errors or die failures through one or more of the following actions: switch between redundant functional units and I/Os on the hybrid die; switch between redundant IC dies on the substrate, invert signal polarity; correct crosstalk errors; perform test and fault isolation.

REFERENCES:
patent: 5798282 (1998-08-01), Bertin et al.
patent: 5946545 (1999-08-01), Bertin et al.
patent: 6545501 (2003-04-01), Bailis et al.
patent: 6614267 (2003-09-01), Taguchi
patent: 6627985 (2003-09-01), Huppenthal et al.
patent: 6861865 (2005-03-01), Carlson

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