Hybrid multilayer wiring board

Details Hybrid multilayer wiring board Hybrid multilayer wiring board

1987-03-10

1987-12-01

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, H05K 0114

Patent

active

047108541

ABSTRACT:
A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permittivity and another type of insulation layer having higher relative permittivity is used between power (ground) line layers interposed by signal line layer(s).

REFERENCES:
patent: 3409732 (1968-11-01), Dahlgren et al.
patent: 3680005 (1972-07-01), Jorgensen et al.
patent: 3740678 (1973-06-01), Hill
patent: 3760091 (1973-09-01), Cannizzaro et al.
patent: 4030190 (1977-06-01), Varker
patent: 4464732 (1984-08-01), Huie et al.
patent: 4560962 (1985-12-01), Barrow
patent: 4591659 (1986-05-01), Leibowitz
Herbert Dixon, A New Generation of Flat-Wire Packaging Techniques, Electronic Engineer's Design Ma., Sep. 1966.

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