Hybrid multilayer substrate and method for manufacturing the...

Details Hybrid multilayer substrate and method for manufacturing the... Hybrid multilayer substrate and method for manufacturing the...

2007-04-12

2009-02-10

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S258000, C361S761000

Reexamination Certificate

active

07488897

ABSTRACT:
A hybrid multilayer substrate includes a cavity in a laminate structure formed of a resin portion and a ceramic multilayer substrate, the resin portion has a protrusion portion, the ceramic multilayer substrate has a penetrating hole, and the cavity is formed by fitting the protrusion portion of the resin portion to an end portion of the penetrating hole of the ceramic multilayer substrate.

REFERENCES:
patent: 2003/0214027 (2003-11-01), Nishitani et al.
patent: 2004/0251044 (2004-12-01), Choi et al.
patent: 2006/0120058 (2006-06-01), Fairchild et al.
patent: 11-260964 (1999-09-01), None
patent: 11-317473 (1999-11-01), None
patent: 2003-304065 (2003-10-01), None
patent: 2003-309213 (2003-10-01), None
Official Communication for PCT Application No. PCT/JP2005/018937; mailed on Jan. 17, 2006.

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