Electricity: electrical systems and devices – Miscellaneous
Patent
1992-05-18
1993-06-22
Thompson, Gregory D.
Electricity: electrical systems and devices
Miscellaneous
361424, H05K 111
Patent
active
RE0342912
ABSTRACT:
A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.
REFERENCES:
patent: 4372037 (1983-02-01), Scapple et al.
patent: 4494095 (1985-01-01), Noji et al.
patent: 4642735 (1987-02-01), Hodsdon et al.
patent: 4724283 (1988-02-01), Shimada et al.
patent: 4734315 (1988-03-01), Spence-Bate
patent: 4736266 (1988-04-01), Tanibe
patent: 4736276 (1988-04-01), Ushifusa et al.
patent: 4811165 (1989-03-01), Currier et al.
R. A. Rinne et al; "Multi-Chip Module Technology", presented at CHMT Symposium, Oct. 1-3, 1984, Tokyo, Japan.
T. Watari et al; "Packaging Technology for the NEC SX Supercomputer", presented at Elec. Components Conf., May 20-22, 1985, Washington, D.C.
J. K. Hagge; "Ultra-Reliable HWSI with Aluminum Nitride Packaging", presented at NEPCON West, Mar. 1989, Anaheim, Calif.
K. P. Shambrook et al; "High-Density Multichip Interconnect", presented at Elec. Components Conf., May 22-24, 1989, Houston, Tex.
S. Sasaki et al, "A New Multi-Chip Module Using a Copper Polyimide Multi-Layer Substrate", presented at Elec. Components Conf., May 22-24, 1989 Houston, Tex.
T. G. Tessier et al, "Polymer Dielectric Options for Thin Film Packaging Applications", presented at Elec. Components Conf., May 22-24, 1989, Houston Tex.
Patent Abstracts of Japan, vol. 7, No. 239-Oct. 25, 1983, & JP, A, 58128754 (Nippon Denki K.K.) Aug. 1, 1983.
M. Takeuchi et al; "A Technology for High Density Mounting Utilizing Polymeric Multilayer Substrate"; presented at Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 26-28 Apr. 1989, Nara, Japan, pp. 136-140.
Goldhammer Kurt R.
Laermer Lothar
Liguori Ralph
Davis David L.
GEC-Marconi Electronic Systems Corp.
Thompson Gregory D.
LandOfFree
Hybrid module electronics package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hybrid module electronics package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hybrid module electronics package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1434330