Hybrid module electronics package

Electricity: electrical systems and devices – Miscellaneous

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361424, H05K 111

Patent

active

RE0342912

ABSTRACT:
A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.

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R. A. Rinne et al; "Multi-Chip Module Technology", presented at CHMT Symposium, Oct. 1-3, 1984, Tokyo, Japan.
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