Hybrid module electronics package

Details Hybrid module electronics package Hybrid module electronics package

1989-09-27

1991-02-26

Thompson, Gregory D.

Electricity: electrical systems and devices

Miscellaneous

361424, H05K 111

Patent

active

049966308

ABSTRACT:
A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.

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J. K. Hagge; "Ultra-Reliable HWSI with Aluminiun Nitride Packaging", presented at Nepcon West, Mar. 1989, Anaheim, Calif.
K. P. Shambrook et al.; "High-Density Multichip Interconnect", presented at Elec. Components Conf., May 22-24, 1989, Houston, Tex.
S. Sasaki et al., "A New Multi-Chip Module Using a Copper Polyimide Multi-Layer Substrate", presented at Elec. Components Conf., 5/22-24/89 Houston Tex.
T. G. Tessier et al., "Polymer Dielectric Options for Thin Film Packaging Applications", presented at Elec. Components Conf., 5/22-24/89, Houston, Tex.

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