Hybrid module and methods for manufacturing and mounting thereof

Details Hybrid module and methods for manufacturing and mounting thereof Hybrid module and methods for manufacturing and mounting thereof

1999-01-29

2000-12-19

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361702, 361712, 361736, 174 163, 257707, 257713, 257722, 333238, H05K 720

Patent

active

061634565

ABSTRACT:
In a hybrid module which is mounted on a mother circuit board with a first surface of a substrate opposed to the mother circuit board, a cavity is formed on the first surface, and a heat-generating circuit component is facedown-bonded in the cavity. Heat generated in the circuit component is radiated to the mother circuit board through a heat radiation plate.

REFERENCES:
patent: 4561006 (1985-12-01), Currie
patent: 4875087 (1989-10-01), Miyauchi et al.
patent: 5548161 (1996-08-01), Hirano et al.
patent: 5572405 (1996-11-01), Wilson et al.
patent: 5831825 (1998-11-01), Fromont
patent: 5952719 (1999-09-01), Robinson et al.

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