Hybrid module and method of manufacturing the same

Details Hybrid module and method of manufacturing the same Hybrid module and method of manufacturing the same

2011-03-29

2011-03-29

Smith, Bradley K (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C257S678000, C257S684000

Reexamination Certificate

active

07915076

ABSTRACT:
A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.

REFERENCES:
patent: 5182632 (1993-01-01), Bechtel et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 6864570 (2005-03-01), Smith
patent: 6885099 (2005-04-01), Ogawa
patent: 6919226 (2005-07-01), Ogawa et al.
patent: 2003/0068852 (2003-04-01), Towle et al.
patent: 07-007134 (1995-01-01), None
patent: 2000-106417 (2000-04-01), None
patent: 2004-193221 (2004-07-01), None

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