Hybrid module and method of manufacturing the same

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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29840, B32B 900

Patent

active

061431214

ABSTRACT:
A hybrid module comprises a plurality of insulating layers which are laminated on one another, circuit patterns formed on each surface of the insulating layers and/or formed between the insulating layers, wherein the circuit patterns are connected with one another by through hole conductors. Further, the insulating layers are formed of layers having a transmittance of a laser beam, wherein the circuit patterns, which are formed between the insulating layers and overlaid on top of another, are irradiated with a laser beam to be thermally fused.

REFERENCES:
patent: 4451324 (1984-05-01), Ichiwaka et al.
patent: 5047283 (1991-09-01), Leatherman et al.
patent: 5061549 (1991-10-01), Shores
patent: 5733823 (1998-03-01), Sugioka et al.
patent: 5879761 (1999-03-01), Kulesza et al.

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