Hybrid module

Details Hybrid module Hybrid module

1999-03-29

2000-09-26

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, 361719, 361761, 361762, 361764, 361728, 361736, 257713, 257717, 174252, 165 802, H05K 720

Patent

active

061250392

ABSTRACT:
A hybrid module comprising a circuit board, a heat generating circuit component mounted on the circuit board and a mother board on which the circuit board is mounted, wherein the circuit component is mounted on the circuit board opposing the mother board, and the surface of the circuit component is fixed to a thermally conductive member having a shape like a film and formed on the mother board. With such an arrangement, heat generated in the circuit component is transmitted to the mother board via the thermally conductive member.

REFERENCES:
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patent: 4755910 (1988-07-01), Val
patent: 4949224 (1990-08-01), Yamamura et al.
patent: 4958258 (1990-09-01), Charruau
patent: 4996630 (1991-02-01), Liquori et al.
patent: 5130768 (1992-07-01), Wu et al.
patent: 5262351 (1993-11-01), Bureau et al.
patent: 5367434 (1994-11-01), Griffin et al.
patent: 5650920 (1997-07-01), Pfizenmayer
patent: 5751555 (1998-05-01), Pfizenmayer et al.
patent: 5877550 (1999-03-01), Suzuki

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