Hybrid/microwave enclosures and method of making same

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

294212, 174 524, 228107, 437221, H01R 900, H01L 2302

Patent

active

054350581

ABSTRACT:
A method of forming enclosures for microwave and hybrid devices and the enclosure itself wherein the metals to be joined are thin (i.e., less than 40 mils thick) and/or thick (up to several inches) and wherein metallurgical hermetic bonds are provided between adjacent metals which are generally difficult to bond to each other and may be bonded by a select number of bonding processes.

REFERENCES:
patent: 5022149 (1991-06-01), Hingorany

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