Hybrid microelectronic circuit package

Details Hybrid microelectronic circuit package Hybrid microelectronic circuit package

1976-05-04

1979-09-11

Abrams, Neil

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361389, H05K 506

Patent

active

041676475

ABSTRACT:
An electronic package including a single substrate for supporting a semiconductor device or die, an integrated circuit chip, or other electronic components on each side thereof. The substrate is configured with a plurality of cavities which are spaced around its outer periphery for receiving a corresponding plurality of electrical pin connections. These pin connections are readily accessible for connection to devices, circuits or other electrical components mounted on both sides of the substrate, thereby maximizing the packing density of the package.

REFERENCES:
patent: 3312540 (1967-04-01), Plumbo
patent: 3381372 (1968-05-01), Capano
patent: 3622419 (1971-11-01), London
patent: 3873173 (1975-03-01), Anhalt

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