Hybrid interconnect and system for testing semiconductor dice

Details Hybrid interconnect and system for testing semiconductor dice Hybrid interconnect and system for testing semiconductor dice

1997-03-21

2000-02-15

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324757, G01R 173

Patent

active

060257318

ABSTRACT:
An interconnect is provided for making electrical connections with a semiconductor die. The interconnect includes a substrate having integrally formed contact members, configured to electrically contact corresponding contact locations on the die. The interconnect also includes a pattern of conductors formed separately from the substrate, and then bonded to the substrate, in electrical communication with the contact members. The conductors can be mounted to a multi layered tape similar to TAB tape, or alternately bonded directly to the substrate. In addition, each conductor can include an opening aligned with a corresponding contact member, and filled with a conductive material, such as a conductive adhesive or solder. The conductive material electrically connects the contact members and conductors, and provides an expansion joint to allow expansion of the conductors without stressing the contact members. Also provided are a system for testing dice that includes the interconnect, and a system for testing wafers wherein the interconnect is formed as a probe card.

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