Hybrid integration of electrical and optical chips

Details Hybrid integration of electrical and optical chips Hybrid integration of electrical and optical chips

2005-02-22

2005-02-22

Lee, John R. (Department: 2881)

Optical waveguides

Integrated optical circuit

C385S031000, C385S036000

Reexamination Certificate

active

06859571

ABSTRACT:
A system of integrating electronic and optical functions includes an electronic chip that also includes monolithic IC electronics for performing electronic functions. Furthermore, the electronic chip includes a plurality of solder bumps for receiving input for processing. An optical chip receives an optical signal and performs optical functions on the signal, and outputs electrical signals indicative of the optical functions performed on the signal. Moreover, the optical chip includes a plurality of solder bumps for sending the electrical signals as input to the electronic chip. The solder bumps of the electronic chip and optical chip are bonded to together so that a hybrid integration is formed that separates the yield of the optical and electrical circuits forming the electronic and optical chip.

REFERENCES:
patent: 4514748 (1985-04-01), Bean et al.
patent: 5249245 (1993-09-01), Lebby et al.
patent: 5394490 (1995-02-01), Kato et al.
patent: 5424573 (1995-06-01), Kato et al.
patent: 6107618 (2000-08-01), Fossum et al.
patent: 6125217 (2000-09-01), Paniccia et al.
patent: 6222951 (2001-04-01), Huang
patent: 6443631 (2002-09-01), Case et al.
patent: 6466349 (2002-10-01), Valley et al.
patent: 6512861 (2003-01-01), Chakravorty et al.
patent: 6674948 (2004-01-01), Yeh et al.
patent: 6692979 (2004-02-01), Yeh et al.
patent: 6718079 (2004-04-01), Gidon
patent: 1 128 197 (2001-08-01), None
patent: WO 9417557 (1994-08-01), None

Affiliated with

Also associated with

Rating

Hybrid integration of electrical and optical chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hybrid integration of electrical and optical chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hybrid integration of electrical and optical chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3470665