Hybrid integrated circuit substrate and method of manufacturing

Details Hybrid integrated circuit substrate and method of manufacturing Hybrid integrated circuit substrate and method of manufacturing

1987-05-13

1988-11-08

Goldberg, E. A.

Electrical resistors

With base extending along resistance element

Resistance element coated on base

338306, H01C 1012

Patent

active

047836423

ABSTRACT:
A hybrid integrated circuit substrate contains an insulating substrate. On predetermined positions of the upper surface of the substrate, there are formed resistors and activation layers to be in contact with ends of the resistors. On predetermined positions of the upper surfaces of the activation layers, there are formed conductor layers electrically connected with the ends of the resistors.

REFERENCES:
patent: 3211972 (1965-10-01), Kilby et al.
patent: 4164607 (1979-08-01), Theil et al.
patent: 4423433 (1983-12-01), Imaizumi et al.
patent: 4446613 (1984-05-01), Beinglass et al.
patent: 4447747 (1984-05-01), LaPotin
patent: 4467312 (1984-08-01), Komatsu

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