Hybrid integrated circuit substrate and method of manufacturing

Details Hybrid integrated circuit substrate and method of manufacturing Hybrid integrated circuit substrate and method of manufacturing

1984-08-01

1987-08-11

Echols, Percy W.

Metal working

Method of mechanical manufacture

Electrical device making

427 98, 427102, 427304, H01C 1706

Patent

active

046852034

ABSTRACT:
A hybrid integrated circuit substrate comprising an insulating substrate. On predetermined positions of the upper surface of the substrate, there are formed cermet resistors and activation layers to be in contact with ends of the resistors. On predetermined positions of the upper surface of the activation layers, there are formed conductor layers electrically connected with the ends of the resistors through the activation layers. The activation layers are formed from an activation paste containing a catalytic metal for enabling deposition in electroless plating in glass ingredients for attaining adhesion with the insulating substrate upon firing. Electrical connection between the conductor layers and the cermet resistors occurs through the activation layers by ohmic contact effected between the cermet resistors and the conductor layers through diffusion layers formed upon firing the activation paste.

REFERENCES:
patent: 3594222 (1971-07-01), Waits
patent: 3676213 (1972-07-01), Marton
patent: 3698940 (1972-10-01), Mersereau et al.
patent: 4278725 (1981-07-01), Riley et al.
patent: 4378384 (1983-03-01), Murakami et al.
patent: 4526810 (1985-07-01), Nesbitt
patent: 4532152 (1985-07-01), Elarde

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