Hybrid integrated circuit package structure

Details Hybrid integrated circuit package structure Hybrid integrated circuit package structure

1989-07-05

1991-02-19

James, Andrew J.

357 70, 357 81, 357 68, H01L 2348, H01L 2328

Patent

active

049948954

ABSTRACT:
A hybrid integrated circuit including: a circuit substrate on which at least one of an active and passive semiconductor element is formed; a lead frame having a plurality of leads and a support plate with an opening formed therein, and supporting the circuit substrate thereon; and a mold of resin for packaging the circuit substrate, support plate and part of the leads of the lead frame, wherein a bottom surface of the circuit substrate is exposed and made to contact the mold resin through the opening. The circuit has a ratio of the exposed bottom surface to the entire bottom surface greater than 50%, and a ratio of surface area of the circuit substrate to a principal surface area of the mold of greater than 60%. There are a plurality of support plate configurations. The circuit relieves the mechanical stress caused in the mold package and eliminates cracking of the mold. Further, a package structure can be made resistant to deformation by appropriately selecting mold thicknesses above and below the circuit substrate.

REFERENCES:
patent: 4816427 (1989-03-01), Dennis

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