Hybrid integrated circuit module

Details Hybrid integrated circuit module Hybrid integrated circuit module

1994-12-14

1996-10-01

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257678, 257713, 361719, 361738, H05K 720

Patent

active

055615929

ABSTRACT:
In a hybrid integrated circuit module in which circuit components, including semiconductor devices and chip components, are integrated and which is bonded onto a heat-sinking substrate, a substrate for mounting chip components is made of a low thermal conductivity material and is bonded onto the heat-sinking substrate; a base plate for mounting semiconductor devices is made of a high thermal conductivity material and is bonded onto the heat-sinking substrate; a hollow cover covers a space above the base plate to make an enclosure between the base plate and the cover; a sealing means hermetically seals the enclosure; and a plurality of interconnection leads is formed through the cover to electrically connect a circuit on the base plate and a circuit on the substrate and for testing operating signals in the semiconductor devices.

REFERENCES:
patent: 3582762 (1971-06-01), Mori
patent: 4001711 (1977-01-01), Knutson
patent: 4297647 (1981-10-01), Akiyama
patent: 4965526 (1990-10-01), Craft
patent: 5159433 (1992-10-01), Kazami
patent: 5223741 (1993-06-01), Bechtel
patent: 5270493 (1993-12-01), Inoue

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