Hybrid integrated circuit including thick film resistors and thi

Details Hybrid integrated circuit including thick film resistors and thi Hybrid integrated circuit including thick film resistors and thi

1975-05-09

1977-06-21

Esposito, Michael F.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427101, 427102, 427103, 427 99, 29620, 338308, H01C 700, B05D 512

Patent

active

040312720

ABSTRACT:
A technique for the fabrication of hybrid integrated circuitry combining the expedients of thick and thin film technology is described. A novel processing sequence for attaining ohmic contact between thick film resistors and thin film conductive metallization involves the use of an interphase gold tab as a conductive link.

REFERENCES:
patent: 3142811 (1964-07-01), O'Connell
patent: 3220881 (1965-11-01), Yando
patent: 3477055 (1969-11-01), Herbst
patent: 3547604 (1970-12-01), Davis et al.
patent: 3560256 (1971-02-01), Abrams
patent: 3669733 (1972-06-01), Allington
patent: 3781749 (1973-12-01), Sles
patent: 3787965 (1974-01-01), Cocca
B231,416, Mar. 1976, Marcantonio, 427/99.

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