Hybrid integrated circuit device with heat suppression means pro

Details Hybrid integrated circuit device with heat suppression means pro Hybrid integrated circuit device with heat suppression means pro

1994-05-26

1996-07-02

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257779, 257784, 257786, 174261, 361760, H01L 2348, H01L 2941

Patent

active

055325173

ABSTRACT:
A hybrid integrated circuit device having a conductor foil pattern connected to a connector lead with increased mechanical strength. A heat conduction suppressing element, such as an opening, is located in the vicinity of a soldered bond to the conductor foil pattern of a metallic circuit substrate having a high thermal conductivity and a connector lead for reducing heat conduction to the substrate during soldering. The bond formed between the conductor foil pattern and the connector lead has remarkably improved bonding quality and mechanical strength.

REFERENCES:
patent: 5434365 (1995-07-01), Mori et al.

Affiliated with

Also associated with

Rating

Hybrid integrated circuit device with heat suppression means pro does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hybrid integrated circuit device with heat suppression means pro, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hybrid integrated circuit device with heat suppression means pro will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1508651