Hybrid integrated circuit device including circuit patterns of d

Details Hybrid integrated circuit device including circuit patterns of d Hybrid integrated circuit device including circuit patterns of d

1996-10-23

1997-07-22

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257762, 257786, 361751, 361774, 361777, 361779, H01L 2348

Patent

active

056506651

ABSTRACT:
A hybrid IC device has an insulation substrate 1. Circuit patterns 2 made of a thick copper film are formed on the substrate 1. The circuit patterns 2 include terminal patterns 8. Through-holes 7 electrically connect the terminal patterns 8 to terminal patterns 81 formed on the bottom surface of the substrate 1. Active elements such as transistors and ICs and passive elements such as resistors and capacitors are mounted on the top surface of the substrate 1 and are electrically connected to the circuit patterns 2. A conductive pattern 6 made of a thick copper film or a thick silver-platinum film is formed on the bottom surface of the substrate 1. The conductive pattern 6 is used for grounding and heat radiation. The conductive pattern 6 is electrically connected to the active and passive elements via through-holes. The through-holes are usually formed Just under the active and passive elements. If the elements are transistors, the through-holes for the transistor are formed outside the orthogonal projection of the transistors on the substrate.

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patent: 5303116 (1994-04-01), Grotz

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