Hybrid integrated circuit device capable of being inserted into

Details Hybrid integrated circuit device capable of being inserted into Hybrid integrated circuit device capable of being inserted into

1987-10-13

1989-11-28

Munson, Gene M.

357 68, H01L 2312, H01L 2952

Patent

active

048841250

ABSTRACT:
A hybrid integrated circuit device comprises a metal substrate, a casing member and external leads. An insulating film is formed on the metal substrate, conductive paths are formed on the insulating film, circuit elements are connected to the conductive paths, and conductive pads are formed in the tip portions of the conductive paths. The casing member comprises a sealing portion surrounding the circuit elements and a connector portion projected from the bottom portion of the sealing portion and extending beyond an end of the metal substrate, and formed of insulating resin. Each of the external leads has one end connected to each of the conductive pads and supported by the side surface of the connector portion.

REFERENCES:
patent: 4503452 (1985-03-01), Yokozawa et al.
patent: 4524238 (1985-06-01), Butt
patent: 4715115 (1987-12-01), King et al.
patent: 4805009 (1989-02-01), Pryor et al.

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