Hybrid integrated circuit device and method of manufacturing...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S254000, C174S261000

Reexamination Certificate

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10941076

ABSTRACT:
An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.

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patent: 6239380 (2001-05-01), Drussel et al.
patent: 6379792 (2002-04-01), Isshiki et al.
patent: 6638592 (2003-10-01), Schulz-Harder
patent: 6844504 (2005-01-01), Wang et al.
patent: 2001/0023113 (2001-09-01), Akram et al.
patent: 6-177295 (1994-06-01), None
patent: 06-177295 (1994-06-01), None

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