Hybrid integrated circuit device, and method of and lead frame f

Details Hybrid integrated circuit device, and method of and lead frame f Hybrid integrated circuit device, and method of and lead frame f

1987-02-17

1988-11-22

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

179 52FP, 357 74, 361412, H01R 4300, H05K 111

Patent

active

047855339

ABSTRACT:
The present invention resides in a hybrid integrated circuit device comprising; a plurality of electronic parts; a wiring board mounting the plurality of electronic parts on the primary front surface thereof; and a plurality of leads secured to the edge of the wiring board, the device being featured in that a fixing section of each of the leads consists of a main fixing portion secured to the primary rear surface of the wiring board, and an auxiliary fixing portion secured to the side face of the wiring board, the auxiliary fixing portion of the lead being branched from the main fixing portion thereof such that the branched auxiliary fixing portion is bent at an angle of approximately 90.degree. with respect to the main fixing portion. This provides the hybrid integrated circuit device in which the leads have the enhanced connection strength against the wiring board, and the wiring board has a lower mounted height.

REFERENCES:
patent: 3689684 (1972-09-01), Cox, Jr. et al.
patent: 4054238 (1977-10-01), Lloyd et al.
patent: 4169642 (1979-10-01), Mouissie
patent: 4214120 (1980-07-01), Jones, Jr. et al.
patent: 4311267 (1982-01-01), Lim
patent: 4682207 (1987-07-01), Akasaki et al.
IBM Tech. Disclosure Bull., vol. 16, No. 4, Sep. 1973, p. 1155 by Liu.

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