Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-12-13
2005-12-13
Elms, Richard (Department: 2824)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S723000, C257S724000, C257S725000, C257S787000, C257S789000, C257S795000
Reexamination Certificate
active
06975024
ABSTRACT:
In a manufacturing method of a hybrid integrated circuit device of the invention, transfer molding is carried put by positioning a curved surface formed in a back surface of the substrate on a lower mold die side and a burr formed in a main surface of the substrate on an upper mold die side. This utilizes the curved surface to inject thermosetting resin in an arrow direction to pour the thermosetting resin through a below of the substrate. There are no broken fragments of burr in a thermosetting resin at the below of the substrate. As a result, a required minimum resin thickness is secured at the below of the substrate, thus realizing a hybrid integrated circuit device having a high voltage resistance, an excellent heat dissipation property and a high product quality.
REFERENCES:
patent: 4822550 (1989-04-01), Komathu
patent: 6157086 (2000-12-01), Weber
patent: 6321734 (2001-11-01), Kaminaga et al.
patent: 2002/0074652 (2002-06-01), Pierce
patent: H11-330317 (1999-11-01), None
Iimura Junichi
Koike Yasuhiro
Okawa Katsumi
Saito Hidefumi
Elms Richard
Fish & Richardson P.C.
Menz Doug
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