Hybrid integrated circuit device

Details Hybrid integrated circuit device Hybrid integrated circuit device

1992-10-09

1993-09-14

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165185, 174 163, 257720, 257470, 257706, 374141, 374145, 361714, H05K 720

Patent

active

052455106

ABSTRACT:
A hybrid integrated circuit device has a primary heat sink and a secondary heat sink. A heat-generating semiconductor chip is mounted on the primary heat sink. A thermocouple is embedded in a portion of the primary heat sink immediately below a heat-generating portion of the semiconductor chip. The thermocouple measures the temperature of the heat-generating portion of the semiconductor chip with a high degree of accuracy. Power supplied to the semiconductor chip is controlled in accordance with the measured temperature of the heat-generating portion of the semiconductor chip, thus enabling the semiconductor chip to operate at its full output performance without risk of breakdown due to overheating.

REFERENCES:
patent: 4561010 (1985-12-01), Ogihara et al.
patent: 4811166 (1989-03-01), Alvarez et al.
patent: 5140394 (1992-08-01), Cobb, III et al.

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